Phambilini, iFixit ithole i-iPhone 11 Pro Max futhi yayihlanganisa. Embikweni wokuqeda amandla, i-iFixit iqinisekisile ukuthi i-iPhone entsha iseyi-4G.
Muva nje, omunye umhlaziyi, i-Techinsights, uphinde wadiliza i-Apple iPhone 11 Pro Max. Izakhi eziphambili zahlaziywa futhi izindleko zeBOM zizonke zahlaziywa.
Ngokusho kokuhlaziywa, izindleko ze-BOM ezibonakalayo ze-iPhone 11 Pro Max (uhlobo lwe-512GB) zingamadola angama-490,5 aseMelika (azungezwe emadollini aseduzane angama-0.5 US), okungaba yi-3,493 yuan, okungama-27,5% ohlobo lwayo lwasebhange likazwelonke olungu-12,699 yuan. Kufanele kuvezwe ukuthi izindleko ezibonakalayo zibhekisa ezindlekweni zento ngayinye, futhi azibali izindleko zokucwaninga nentuthuko.
Imodyuli engemuva yekhamera ye-iPhone 3 Pro Max inenani eliphakeme kakhulu lezindleko, efinyelela cishe ku-15%, ngo- $ 73,5. Kulandelwa yisibonisi sesikrini kanye ne-touch ($ 66.5) ne-A13 processor ($ 64).
Ngasohlangothini lwe-SoC, iprosesa le-Apple A13 ngaphakathi kwe-iPhone 11 Pro Max lihlukaniswe yi-Techinsights libalwe APL1W85. Iprosesa ye-A13 nephakethe le-Samsung K3UH5H50AM-SGCL 4GB LPDDR4X SDRAM lihlanganiswe ndawonye ePoP. Usayizi weprosesa we-A13 (die seal onqenqemeni) ngu-10.67mm x 9.23mm = 98.48 mm2. Ngokuphambene, indawo ye-processor ye-A12 ingu-9.89 × 8.42 = 83.27 mm 2, ngakho-ke indawo ye-A13 inyuswa ngo-18.27%.
Kwe-baseband, kusetshenziswa i-Intel PMB9960, engahle ibe yimodemu yeXMM7660. Ngokusho kwe-Intel, i-XMM7660 imodemu yayo yesizukulwane sesithupha i-LTE ehlangana nokukhishwa kwe-3GPP. Ixhasa isivinini esifinyelela ku-1.6 Gbps ku-Downlink (Ikati 19) nokufika ku-150 Mbps ku-uplink.
Ngokuphambene nalokho, i-Apple iPhone Xs Max isebenzisa imodemu ye-Intel PMB9955 XMM7560, esekela kuze kufike ku-1 Gbps ku-Downlink (Cat 16) kuze kufike kuma-225 Mbps ku-uplink (Cat 15). Ngokusho kwe-Intel, i-modem ye-XMM7660 ine-design node ye-14 nm, efanayo ne-XMM7560 yangonyaka odlule.
I-RF transceiver isebenzisa i-Intel PMB5765 yama-transceivers e-RF anama-Intel baseband chips.
Isitoreji seNand Flash: Kusetshenziswa imodyuli yeToshiba engu-512 GB NAND flash.
Imodyuli ye-Wi-Fi / BT: Imodyuli enguMurata 339S00647.
I-NFC: Imodyuli entsha ye-NXP ye-SN200 NFC & SE ihlukile kune-SN100 eyasetshenziswa ku-iPhone Xs / Xs Max / XR ngonyaka odlule.
I-PMIC: I-Intel PMB6840, i-Apple 343S00355 (APL1092), lokhu kufanele kube ngumklamo uqobo lwe-Apple we-PMIC oyinhloko weprosesa ye-A13 bionic
I-DC / DC: I-Apple 338S00510, iThuluzi laseTexas TPS61280
Ukulawulwa Kwebhethri Kwabhethri: I-STMicroelectronics STB601, iThuluzi laseTexas SN2611A0
Ukuphathwa kwamandla okubonisa: Samsung S2DOS23
I-Audio IC: i-Apple / Cirrus Logic 338S00509 yomsindo we-codec nama-amplifires amathathu wokulalelwayo angama-338S00411.
I-Envelope Tracker: Isebenzisa i-Qorvo QM81013
Isiphetho esingaphambili se-RF: i-Avago (Broadcom) AFEM-8100 module yangaphambili-ukuphela, imojuli yeSkyworks SKY78221-17, i-Skyworks SKY78223-17 imodi yokuphela kokuphela, i-Skyworks SKY13797-19 PAM, njll.
Ukushaja okungenantambo: I-STMicroelectronics 'STPMB0 chip kungenzeka ibe yisithole sokushaja okungenantambo nge-IC, ngenkathi i-iPhone eyedlule isebenzise i-Broadcom chip.
Ikhamera: U-Sony usengumhlinzeki wamakhamera amane wokubuka we-iPhone 11 Pro Max. Ngonyaka wesithathu ngokulandelana, i-STMicroelectronics isebenzise i-chip yayo yekhamera ye-IR yomhlaba wonke njengomtshina wohlelo lwe-FaceID olususelwa ukukhanya lwe-iPhone.
Okunye: STMicroelectronics ST33G1M2 MCU, NXP CBTL1612A1 isibonisi port portlexer, uCypress CYPD2104 USB Type-C port isilawuli.